Conforms to VITA 46 VPX specifications. 9"L x 5. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). ACT developed an integrated design and delivered turnkey parts that were developed to be highly ruggedize and provided thermal conductivity > 750 W/m-K. This fully-defined, backplane-centric VPX module optionally supports either commercial GNSS receivers (i. 4, liquid flow-through, probably the most efficient up to 450 watts per card. In some ways, AFT is a hybrid between air and conduction cooling, but with greater cooling capability. The PMC-1553 is the Only Commercial Off the Shelf (COTS) Card that Passes and Executes the SAE AS4111/4112. VPX Backplane, 3 U, 5 Slots, Full-Mesh, Without RTM. 8 in. NXP (formerly Freescale) QorIQ P2020 Dual-Core Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer. It also supports dual Gigabit Ethernet, GPIO, I²C, XMC I/O, PMC I/O. Compare. or 1. 2 conduction-cooled modules due to an established deployment track record. . Accessories. FPGA BSP (FBSP) High-Speed Links (HYDRA) Advanced Board Management Controller (aBMC) Highlights. It’s hybrid cooling design stretches the cooling capabilities in equipment built with readily available VPX, VITA 48. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. Specification Ordering Information Related Products Resources Summary The ADC-VPX3-XMC is a single XMC carrier for VPX based systems. 3U OpenVPX (VITA65) conduction cooled form factor; Applications. Intel Xeon Quad Core Xeon E3-1505M V5 (47W) Intel C230 series CM236 PCH chipset; Up to -40 to 85°C extended operating range; Programmable CPU power for heat sensitive apps. It supports up to two 0. VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. Systems based on ANSI/VITA 48. Product Type: Guide Rail. 0 in. Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2 EN55022:2010 Equipment ClassB. It is designed for use in deployed industrial and military applications in harsh environments. Talk to a Hartmann representative today about compliance and your power needs. This chassis family is part of the industry leading Atrenne, a Celestica company, product line of high. 8 in. Data Center Solutions. Advanced airflow design distributes air across external fins in sidewalls. Operating Temperature Range Storage Temperature Range; Min Max Min Max; AC1: Air Cooled Industrial-40°C +70°C-55°C +100°C: CC1: Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2FPGA, 19 Zoll, Nvidia Jetson, CPCI, VPX air cooled, VPX conduction cooled, MicroTCA, Ip-Core, and NVME SSD Locations Primary Industriestraße 10. The heat from the internal conduction-cooled modules is conducted to sidewall exchangers, where it is dissipated to the ambient environment by forced-air cooling. Download. True 6 Channel supply provides full Open VPX support. XPand1007. The development kit includes the cables needed to connect the XPand6200. Type: Conduction Cooled Assembly VPX. Abaco’s SBC3612D rugged 3U VPX single board computer delivers the highest performance you can get in a 3U Intel® base. operatiNG temperature 0°C to +55°C Air-Cooled; -40° to +85°C Conduction-Cooled staNDarDs Open VPX MOD3-SWH-2F24U module usable in SLT3-SWH-2F24U-14. 1. 2) modules. They can be used to power a VPX chassis and will fit into the standard envelope defined by. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. VITA 62 3U 400W AC/DC VPX power supply; Universal AC Input: Single Phase, 85-264VAC, 47-400Hz;Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. StoreEngine is designed to work as a standalone single slot storage device with. Most VPX systems make use of VITA 48. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal. 2 specification. This enables the VX305C-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. -40 - 85°C (Conduction Cooled) Capture only. Elma’s conduction cooled power supply modules are designed to meet the requirements of VITA 62 for use in harsh environments. Talk to a Hartmann representative today about compliance and your power needs. Eight 6U VITA 48. A x8 PCI Express 2. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. FREMONT, Calif. Compare. Air flow from bottom to top (Other options available on request) Standard 3U rear transition module. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. 8 in. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. Boards are inserted in the back of the chassis in a vertical orientation. -50°C to +100°C Relative Humidity 95% non-condensing Altitude 60,000 feet, operating Power Consumption 52. 3"H Chassis Cooling: Conduction-Cooled Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O 1 * Kintex® UltraScale™ FPGA. The 3U VPX XMC Carrier is a rugged conduction cooled single slot 3U VPX XMC Carrier that can connect one XMC module to a standard VPX backplane using PCIexpress 1x 8lane or 2x4 lane configurations. Abaco Announces Production of. Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40 0 C to +85 0 C at the wedge lock edge. Desk-top chassis for 6U VPX cards (WxDxH: 350x435x593mm) For five front cards and RTMs with a card width of up to 1. 2 • 3U or 6U configurationsANSI/VITA 48. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. PXI Express Chassis Systems. Up to 32GB of high-speed. Chassis Example: WILD40 Forced-Air, Conduction-Cooled 3U OpenVPX Chassis has an operating temperature of –40˚C to +70˚C. Mercury envisions, creates, and delivers innovative technology solutions purpose-built to meet their customers. It features optional 6x100G optical transceivers to VITA 66 backplane and optional front panel RS422/RS485 GPIO interface. 1 * Kintex® UltraScale™ FPGA. XChange3000. This system. VPX/OpenVPX : Cooling: Liquid-Cooled : Depth: 12. 2 conduction cooled modules because of their established deployment track record. Shock: 40G peak for conduction-cooled; Dimensions: 160mm x 100mm x 25. AoC3U-410 Conduction Cooling with Air Assist. The XChange3031 is a conduction-cooled 3U VPX Ethernet switch module. It features a FMC+ slot. The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. 8 in. Our selection of Intel, NXP Power. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. 2 and stretch the limits at the. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. The panels on both the front and rear slots are removable for ease of probing and debugging. 8 in. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. manufactures and sells Power Supplies for various COTS architecture systems to include custom and standard designs. Categories: Accessories: VPX Accessories, VPX Products: Accessories. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. The open frame concept offers enhanced flexibility, with fast conversion between air and conduction cooled module guides and fast backplane replacement for easy reconfiguration in support of. Load sharing circuitry for up to 4 modules. 0” pitch card spacing, and the Chassis I/O PWB uses standard D38999 Series Connectors for SBC and Graphics I/O, System I/O, Test/Software. Related products. SATA, PCIe, and NVMe interfaces. 2 Type 2, Secondary Side Retainer. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. (L) x 4. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. The XPand1201 is a low-cost, flexible, development platform. -No. Power and reset LEDs are provided for. Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). 0 in. blank = mSATA available in Air Cooled configuration*, /C3 = mSATA cutouts 4399-00 (only required when CC1 cooling option selected) XMC Connector Type: t: blank = XMC (VITA 42) Connectors , /X2 = XMC2 (VITA 61) Connectors: Note * - mSATA sockets are always available unless ordering a conduction cooled (CC1) board. 14 Slot VPX Conduction-Cooled System with Air Assist. Conduction cooling - cold plate Conduction cooled modules 75 500 Forced Air Conduction Cooled (internal fan or external supplied air)7SL-3500 3U-VPX. 0 in. or 1. 3U CompactPCI 2. Failure to observe proper handling and installation procedures can6U, conduction-cooled VPX modules. This platform supports up to eight 0. 5-3- Two 4-lane PCIe fabric ports Power <15W Linux ® and WindRiver VxWorks BSPs Pin compatible with VPX3-131, VPX3-133 and VPX3-1257 Designed for harsh environment applications, both air-cooled and conduction-cooled Introduction Curtiss-Wright Defense Solutions' VPX3-This development chassis enables shortened design cycles for faster time to deployment. Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. Intel® Xeon® D-1500 Processor-Based Rugged Small Form Factor (SFF) COTS System with Xilinx Kintex® Ultrascale™ FPGA. or 1. or 1. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. It is 100GbE-enabled, SOSA-aligned, and highly rugged and thermally. It helps test a system's coolingcapabilities. VPX6860: 6U AcroExpress OpenVPX SBC Air or Conduction-Cooled Description. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. With both air-cooled and conduction-cooled boards and. pitch slots and built in accordance. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. High Performance Embedded Computing. 0 in. 8 in. Block Diagram. The XChange3030 provides six backplane 40GBASE-KR4 Ethernet ports, six backplane. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. Input: 80 to 264V AC. The DK3 allows fast backplane replacement and conversion between air and conduction-cooled slot inserts. 8-inch and/or 1. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. Contact Us. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. Both XMC and PrPMC interfaces are active simultaneously. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. It is available in commercial air-cooled and ruggedised versions up to and including conduction cooling. The VTX985 is a dual slot 3U VPX chassis conduction cooled for two 3U VPX modules. 2 3U VPX chassis. 5, and Vulkan 1. Acromag’s XMC-7K modules feature a high-performance user-configurable Xilinx® Kintex®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. 115 Watts Primary or Secondary Side wedgelocks. Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. A conduction-cooled option is available for more rugged operating environments. 3U Conduction cooled models available on 1″ form factor. pitch air-cooled VPX (VITA 48. Theconduction-cooled VPX load board helps confirm the chassis meets the VITA46/48/65 power specifications for VPX and aids in locating hot spots within theenclosure. This 3U VPX payload slot module can be used to extend the PCIe bus to any other PCIe based. All offers are typically available for. (VPX / cPCI/ VME) and custom designs. Configure your PCB Wedge Lok. Item/Part Number: 1940000446-0000R Product Features Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards Verifies chassis can meet power requirement and. A onboard DC/DC converter. Combine various standard components to create a Wedge Lok that satisfies your requirements. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. 8 in. It features dual 9 slot backplanes including PSU slots. Intel® Xeon® D-1700 Processor-Based 3U VPX-REDI Module with 48 GB of DDR4, 40 Gigabit Ethernet, and SecureCOTS™. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. Created Date: 3/20/2017 10:06:58 AM. 3 V. 3U Switch. Higher conduction means lower component temperatures . 0 Ruggedized Enhanced Design Implementation. XMC slot. 2) modules. 2 conduction cooled modules and VITA 67. It is designed to accommodate best-in-class 3U CMOSS and SOSA aligned payloads to meet mission needs with minimal time to theater. VITA 48. 3 Up to 24x 10 GETH. Compare Products. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of applications across multiple industries. Fast backplane replacement makes for easy reconfiguration in support of every stage of development. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. Compare Products. The modules can be easily tailored to suit individual requirements, VPX Test Adapter. The XPand1205 is a low-cost, flexible development platform, supporting up to eight 0. Accessories. COOLING EMBEDDED VME AND VPX SYSTEMS. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. Our Card and Software Packages are Designed for Fast, Portable Integrations. Works With: Subracks; Cases. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. or 1. Conduction-cooled modules include an additional 10/100Base-TX port available on the rear VPX connector. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). Backplanes are 100% configurable using Meritec cabling allowing. Just like the NI Ettus Research USRP E320, the VPX3-E320 features a flexible 2 x 2 MIMO RF Agile Transceiver with 12-bit ADC and DACs. 0 specification for use in Mil/Aero VPX systems. Ideal for SBCs or carriers for VPX, VME and cPCI (Compact PCI/PCIe or PXI) - Commercial or Rugged/Conduction Cooled Systems. 3 V Aux contactus@redrock. Three tri-color front panel LED’s to. Features include: conduction cooling, 1" pitch, nternal EMI filters, I2C. Downloads. The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset. Conduction or air cooling. 2. 8 are already available, such as this 3U VPX COTS system with air-flow-through cooling. Air cooled: 3U VPX 0. "With its optimized cooling path and quick turn customization of the. The Chassis CPU will monitor and maintain the VPX module wedge. VPX carrier cards provide a simple and cost-effective solution for interfacing mezzanine I/O modules to a VPX computer system. Development chassis for VPX and SOSA aligned module payloads. It supports up to two 0. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. Designed for COTS applications this Intel SBC utilizes the Intel C230 series PCH chipset for extensive I/O support. 1 ATR platform with liquid cooled side walls, 6U conduction cooled boards, 1” pitch, per VITA 48. Open Frame Reduces System Design Time. The Condor GR5-P2000 is a 3U VPX graphics & GPGPU card that is based on the “chip-down” NVIDIA® Quadro® Pascal™ P2000 GPU (GP107). Convection (air) and conduction with extended temps. The XPedite7672 is an optimal choice for computationally heavy applications. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. It is designed for use in deployed industrial and military applications in harsh environments. Learn more about this product below »Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. View. True 6-Channel design provides full OpenVPX support. 8, for 3U and 6U VPX module-based systems to overcome SWAP-C (size, weight, power and. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. 8 Live NTSC/PAL/RS-170 video inputs; 4 x Audio input; 8 x D1 size capture at full frame rate; Conduction cooled 3U VPX module; Overlay frame grabber PAL RS-170 NTSC video capture OpenVPX VPX. Nerve conduction studies (NCS) are tests used to evaluate the function of the peripheral nerves. GHz wideband converter is a SOSA-aligned, conduction cooled, VPX RF Payload Card, which provides one channel up, one channel down, and a synthesizer in a single, 3U slice. The specification of 6U VPX calls for computer cooling via a conduction-cooled envelope compliant with the IEEE standard IEEE-1101. For use in DC systems, they are 3 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. The Rise of VPX Cooling Requirements VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. Many embedded electronics systems with VME/VPX boards have the following configuration: Figure 1. Operating Temp. The chassis is cold plate base coupled conduction cooled. 2 Type 2, Secondary Side Retainer. View product. WOLF’s 3U VPX modules use the 1" pitch allowed in VITA 48 (VPX REDI). 7SL-3500 Hybrid conduction cold plate assisted by forced air sets with aggregate power. CCG-6860 Conduction Cooled Card Guide. LOWER RISK. XMC. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. XIt1086 (90040055) - 3U VPX Rear Transition Module with PCIe, 10 Gigabit Ethernet, eSATA, USB, Serial, and Expandable XIM Sites; XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O; XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules The XPedite7672 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processors. American National Standards Institute, VITA Standards Organization. 5"L x 5. Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX™ compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. Supported ruggedization levels (see the X-ES. The ICE-Lok® thermally enhanced Wedge. OpenVPX now boasts several standards that provide various means of dissipating heat within a system. The . Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. Form Factor: 3U VPX Ethernet: 2 10GBASE-T, 4 10/100/1000BASE-T USB: 2 USB 2. The removable storage canisters can be optimized for client operations. Learn more about this product below »XMC Module | Conduction- or Air-Cooled. 3U VPX 40G Ethernet Switch | Layer 2 Switching Conduction-cooled 3U VPX Ethernet switch module. 3U VPX Test Module performs a wide variety of functions and applications such as: Compliance testing of VITA Rules for OpenVPX conduction cooled systems; Design Validation of systems based on Power and Thermal simulation of deployed board set; Emulate system operating current profile based on multiple current image mapping of. 2 Type 2, Secondary Side Retainer. 3VIO, Short tail connectors on J1, long tail connectors on J2. 1connectors not included 119EXT6024-06XXR 6U VPX Extender 6U - P0 utility, P1, P3 to P6 differential, P2 single ended 119EXT6024-05XXR 6U VPX Extender 6U - P0 utility, P1 to P6 differentialIt includes the complete connector complement under the standard thus enabling streamlined testing of target payloads. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. It supports up to two 0. MIL-STD-704F compliant except 50mSec holdup provided by separate module. 3U Conduction cooled models available in 1″ form factor. VPX-XMC Conduction-Cooled Adapter Assembly . Contact factory for appropriate board configuration based on environmental requirements. Extremely robust, bullet proof design ♦ Fully integrated power supply, backplane, I/O in one box ♦ 4-Slots of 3u VPX on 1” pitch (OpenVPX Ready) ♦ Full environmental sealing per DO-160E ♦ Vita 48. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. Systems Integration Plus, Inc. 0 in. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). Signal rate: 3. The PCIexpress bus extention kit permits a host CPU to expand its available PCIe slots. Ethernet. TR E8x/msd-RCx – Rugged 3U VPX Processor. Options for discrete controlled military secure erase. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. pitch conduction-cooled VPX (VITA 48. pitch conduction-cooled VPX (VITA 48. 2 conduction cooled configuration and ready for rugged applications. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. The XPand1015 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. pitch without solder-side cover; 0. It supports up to 16GB of on-board DDR3 ECC memory and supports mSATA SSD. 48. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. 2 Conduction. The development systems use Concurrent Technologies' commercial off the shelf boards which are also available as rugged conduction cooled, VPX-REDI boards ensuring that applications which are produced on the development Systems can be easily progressed to a ruggedized implementation. Form Factor: VPX Size: 3U. Air and conduction cooled options; Made in the USA; New products aligned with SOSA™ Technical Standard; VxWorks, Linux, and Windows support. 2 / VPX conduction cooled thermal load board module. pitch;. OC-CC-VPX-3U-5HP-SS-300-LB48 WT ASSY # - 43094 3U VITA 48. Formally known as ANSI/VITA 48. Input Voltages: 15-40 VDC. It provides an easy way to integrate switched mezzanine cards into modern VPX backplanes. View product information for IPMI Controller & software for VPX Systems. Since heat energy wants to move from. 85 and 1. 0 in. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. 2) modules. VPX 3U. (H) Four 0. Conduction cold plates with enhanced material conductivity such as Thermacore’s k-core APG and heat pipe cold plates in the VPX format can be used to design electronic systems with power levels above that possible with pure aluminum cold plates, but can still rely on conduction cooling rather than utilizing active systems such as forced. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of. The VPX340 (400W) and VPX336 (360W) can be used to power VPX / Open VPX chassis and will fit into the standard. Each VPX port can be configured to be x4 or x8. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. It features dual 9 slot backplanes including PSU slots. Form Factor: 3U VPX Ethernet: 4 10/100/1000BASE-T USB: 2 USB 2. 3 to the P15 connector for interfacing with the host module. 0 in. The XPand1203 is a low-cost, flexible, development platform. However, as module power continues to increase, VITA 48. PCI Systems, a supplier of conduction cooled systems, has announced a 3U VPX Gen3 8x Lane PCIe to VPX adapter. 2 (REDI) and VITA 65 (OpenVPX™). Elma Bustronic Corp. The SX-150 is available in the VITA 48. 6"W x 9. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. The AoC3U-400 Series of chassis use leading edge technology to manage high heat dissipating board payloads. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Processor and memory chips tend to generate the most heat, with new processors drawing up to 200 watts at maximum functionality. Our expertise also includes VITA 66, VITA. 85 and 1 in. 91 KB. Compatible with Dawn’s HLD-6262 Holdup Module. 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules. 2 RS-232, 2 RS-232/422/485 Chassis Type: Sub-½ ATR Number of Slots: 2 Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. AT-VPX-PMC/XMC-CAR is one of a family of modules to employ open architecture VITA 46 standard primarily to marry High Speed Interconnect such as Rapid IO and PCI Express. Environment: Extended Temperature, Extended shock & vibration : Height: 10. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. The XMC-1553 is the Only Commercial Off the Shelf (COTS) Card that Passes and Executes the SAE AS4111/4112. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. 0 port is routed per VITA 42. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. 2 for conduction cooling • VITA 46 board connectors • IEEE 1101. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 8 in. ANSI/VITA 0- 001[R 005] defines the rules for designing Our VPX backplanes are designed to allow any COTS or customer spec by providing a wide range of available VPX and OpenVPX profiles. 11-1019958-x4 = Conduction cooled version 47915 Westinghouse Drive, Fremont, CA 94539 phone 510-657-4444 fax 510-657-3274 [email protected]″ form factor. 877-214-6267 salesacromag. Horizontal air-flow cools over 150W per slot to support state-of-the-art processor boards. Tested to MIL-STD-810, VITA47. VPX7650. SE306S-CCVPX- Conduction 6 SSD XMC Yes 6 GB/s 12TB No StoreEngine 3U Air Cooled VPX SE300‐VPX‐ND accomodates standard I/O XMCs StoreEngine 3U Conduction Cooled VPX SE300‐CCVPX‐ND accomodates standard I/O XMCs via a removable front panel/heat frame element StoreEngine 3U Air Cooled VPXThe VPX CUBE features 4 slots of 3U VPX on a 1″ pitch high bandwidth backplane and an integrated, wide temperature range 400 Watt power supply. 6U/ 5HP VPX load card, conduction cooled. Both are designed to support a minimum of ten 0. 3A/37A (normal/peak inrush current)performance leaps relative to VME and early VPX systems of just a few years ago. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. VX3060-S2 Rugged Air cooled variant is designed to meet VITA 47 class EAC6 V2 and can operate in extended temperature environ-ments up to of -40 °C/+70 °C. 85°C (derating above 60°C) Size: 3U, 0. VPX hold up power supply is a type of power supply used in high-performance computing applications. 8 in. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. 1 switch and 10G backplane Ethernet switch in a single 3U module, enabling you to connect between a wide range of module types – including those with earlier Gen 1 or Gen 2 PCIe interfaces. Air (Convection) Cooled – ANSI/VITA 48. The SBC627 rugged 6U VPX single board computer offers more processing power, more bandwidth, and more graphics capability – with no increase in the size, weight or power requirements of previous generations – enabling fewer system slots to be used. Provides up to an 8-slot system for 3U convection cooled boards and 3U transition modules on 1. The XPand1303 is a low-cost, flexible, development platform. 1. Software. Block Diagram. 100 Ohm differential pair routing. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. Serial I/O. Compatible to both air cooled and conduction cooled. Development chassis for VPX and SOSA aligned module payloads. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your. This 3U Module enables an isolated thermal path Air Flow Through (AFT) – ANSI/VITA 48. LCR Embedded Systems. 3U Open VPX, MOD3-SWH-2F24U module; Air-cooled - Backplane: 22x 10GBase-KR, 1x 10/100/1000Base-T user configurable front panel or backplane. Convection and Conduction cooled ATR (Air Transport Rack) enclosures offer a standardized, cost effective solution for PCI, VME, VME64x, VXS, cPCI and VPX based applications. VMEbus International Trade Association, 2010.